Plates
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Copper plates are used for the production of electronic and electrical panels, as well as for screening.
- Plates Properties
Alloys according to EN 1652 and EN13599 standards
Symbol Number Cu{%-min) Ρ (%-Range) Ο (%-max) Cu-ETP CW004A 99.90 - 0,040 Cu-PHC CW020A 99.95 0,001-0,006 - Cu-HCP CW021A 99.95 0,002-0,007 - Cu-DLP CW023A 99.90 0,005-0,013 - Cu-DHP CW024A 99.90 0,015-0,040 - Products can also be supplied in conformance to respective international standards, such as ASTM series, DIN series as well as JIS series. Tolerances tighter than specified in above standards are available upon request.
Physical Properties (at Ambient Temperature of 20 oC)
CU
Density (gr/cm3)8,93
Melting Point (L/S* ίπ oC)1.083 * L/S = Liquid/Solid
Typical Mechanical Properties of Cu
Alloy Temper Tensile Strength
(MPa)
Yield Strength
(MPa)
Elongation
(%)
Hardness
(HV)
Cu R200 200 - 250 100 max - - R220 220 - 260 140 max 33 - Η040 - - - 40 - 65 R240 240 - 300 180 min 8 - Η065 - - - 65 - 95 R290 290 -360 250 min 4 - Η090 - - - 90 - 110 R360 360 min 320 min 2 - Η110 - - - 110 min - Plates Characteristics
Alloys: Cu DHP, ETP, SE, CuSn.
Manufacturing Range
Thickness Width Length Temper 8 - 9,99 100 - 1250 250 - 6000 HARD AS ROLLED 10 - 38 100 - 1250 250 - 6000 SOFT/1/4, 1/2, HARD, HARD AS ROLLED, HOT ROLLED 38 – 180 100 - 1250 250 - 6000 HOT ROLLED (SOFT) Above 100mm - upon request